Polymer films and electronic devices

ABSTRACT

In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including 15 to 35 mol % of a first monomer that is a crankshaft monomer and 15 to 35 mol % of a second monomer that is a flexible monomer, and two or more diamines, including 1 to 35 mol % of a third monomer that is a rotational inhibitor monomer and 15 to 49 mol % a fourth monomer that is a rigid rotational monomer, wherein the mol % of each monomer is based on the total of all four monomers. The polymer film has a dielectric dissipation loss factor, D f , of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m 2 ×day) or less.

FIELD OF DISCLOSURE

The field of this disclosure is polymer films and electronic devices.

BACKGROUND OF THE DISCLOSURE

The field of wireless communication and broadband technology hasprogressed dramatically with the growth in the market for portableelectronic devices such as mobile phones and tablets. To meet theever-increasing requirements of transmission data volume and speed, thetransmission frequency of circuits is by necessity increasing. Thepolymeric materials used in these high-power electronic devices mustsatisfy a number of critical thermal, environmental, and electricalrequirements to meet the required performance criteria formicroelectronics applications. These desired attributes include thermalstability, low moisture uptake, high breakdown voltage (low leakagecurrent), low dielectric constant and low dissipation factor. Polymerswith these properties enable the use of advanced electronic packagingtechniques, resulting in improved system performance and reliability.However, the integrity of high-frequency signals can be damaged bytransmission loss. The dielectric loss of dielectric materials dependson their current frequency, dielectric constant (D_(k)), and dissipationfactor (D_(f)). Consequently, the dielectric loss increases with anincrease in the current frequency. The general method for reducing thisloss is to use low D_(k) and D_(f) materials.

Dielectric constant is the ratio of the permittivity of a substance tothat of free space. A material containing polar components, such aspolar chemical bonds, which are presented as electric dipoles, has anelevated dielectric constant, in which the electrical dipoles alignunder an external electric filed. As a result, a capacitor with adielectric medium of higher D_(k) will hold more electric charge at thesame applied voltage or, in other words, its capacitance will be higher.The dipole formation is a result of electronic polarization, distortionpolarization, or orientation polarization in an alternating electricfield. These phenomena have characteristic dependencies on the frequencyof the alternating electric field, giving rise to a change in the realand imaginary part of the dielectric constant between the microwave,ultraviolet, and optical frequency range.

The dielectric loss tangent (tan(δ)) is a measure of how much of thesignal pulse (electromagnetic wave) propagating down a printed circuitboard (PCB) transmission line will be lost in the dielectric region(insulating material between copper layers). Material datasheets and PCBmanufacturers commonly refer to this signal loss as the dissipationfactor (D_(f)). tan(δ) or D_(f) is the result of electromagnetic waveabsorption by the dielectric material and depends on the material'sstructure, electrical conduction, dielectric relaxation, dielectricresonance, and environmental effects. A lower loss tangent results inmore of the original transmitted signal getting through to itsdestination. This is important for transceiver-based designs wheremulti-gigabit signals must be transmitted across long backplanechannels. A large loss tangent means more dielectric absorption and lessof the transmitted signal is getting through to its destination.Ideally, selecting the lowest loss material is the best choice for nextgeneration electronics to minimize signal attenuation and achieve highdata rates.

Many different polymers having good insulating properties and lowdielectric constants have been used in electronic device applications.Thermoplastic materials, for example, fluorine resins, such aspolytetrafluoroethylene (PTFE), or liquid crystal polymer (LCP), havebeen used. Their D_(k)'s and D_(f)'s are sufficiently low to minimizedielectric loss, but these thermoplastic materials present certainprocessability challenges, including drilling/laser compatibility,plating nonuniformity, melt squeeze out during copper lamination, andpoor adhesive strength to copper. The ideal material will have lowdielectric constant, low dissipation factor, and good film formingproperties, high heat resistance, good adhesion to a variety ofsubstrates, and very low moisture uptake. Other properties that are veryimportant for many applications include low cost of manufacturing, lowflammability, good chemical resistance, and the exclusion of residualionic contamination such that dielectric properties are not compromised.Currently, there is no single material that fulfills all of thesecritical requirements.

The foregoing general description and the following detailed descriptionare exemplary and explanatory only and are not restrictive of theinvention, as defined in the appended claims.

DETAILED DESCRIPTION

In a first aspect, a polymer film includes a polyimide, wherein thepolyimide includes two or more dianhydrides, including 15 to 35 mol % ofa first monomer that is a crankshaft monomer and 15 to 35 mol % of asecond monomer that is a flexible monomer, and two or more diamines,including 1 to 35 mol % of a third monomer that is a rotationalinhibitor monomer and 15 to 49 mol % a fourth monomer that is a rigidrotational monomer, wherein the mol % of each monomer is based on thetotal of all four monomers. The polymer film has a dielectricdissipation loss factor, D_(f), of 0.005 or less, a water absorption of2.0% or less and a water vapor transport rate of 50 (g×mil)/(m²×day) orless.

In a second aspect, a metal-clad laminate includes the polymer film offirst aspect and a first metal layer adhered to a first outer surface ofthe polymer film.

In a third aspect, an electronic device includes the polymer film of thefirst aspect.

Many aspects and embodiments have been described above and are merelyexemplary and not limiting. After reading this specification, skilledartisans appreciate that other aspects and embodiments are possiblewithout departing from the scope of the invention. Other features andadvantages of the invention will be apparent from the following detaileddescription, and from the claims.

The polymer films of the present invention include polyimides having atype of out-of-plane orientation along the polyimide backbone structureto provide a low dielectric dissipation factor without undulydiminishing other critical properties. The films of the presentinvention are particularly well suited for use as substrates forsupporting fragile metal layers having precise patterns and dimensions.

The substrates of the present invention comprise at least one film witha particular type of base polymer. “Base polymer” as used herein isintended to mean the dominant polymer component (at least 50, 55, 60,65, 70, 75, 80, 85, 90, 95 or 100 weight percent of all polymers presentin the film). Generally speaking, the base polymer will be at least 25,30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100 weightpercent of the overall film.

The base polymer of the present invention is a polyimide synthesized bya poly-condensation reaction, involving the reaction of one or morearomatic diamine components with one or more aromatic dianhydridecomponents.

As used herein, an “aromatic” monomer is intended to mean a monomerhaving at least one aromatic ring, either alone (i.e., a substituted orunsubstituted, functionalized or unfunctionalized benzene orsimilar-type aromatic ring) or connected to another (aromatic oraliphatic) ring. An aromatic backbone chain segment is intended to meanat least one aromatic moiety between two adjacent imide linkages.

Depending upon context, “diamine” as used herein is intended to mean:(i) the unreacted form (i.e., a diamine monomer); (ii) a partiallyreacted form (i.e., the portion or portions of an oligomer or otherpolymer precursor derived from or otherwise attributable to diaminemonomer) or (iii) a fully reacted form (the portion or portions of thepolymer derived from or otherwise attributable to diamine monomer). Thediamine can be functionalized with one or more moieties, depending uponthe particular embodiment selected in the practice of the presentinvention.

Indeed, the term “diamine” is not intended to be limiting (orinterpreted literally) as to the number of amine moieties in the diaminecomponent. For example, (ii) and (iii) above include polymeric materialsthat may have two, one, or zero amine moieties. Alternatively, thediamine may be functionalized with additional amine moieties (inaddition to the amine moieties at the ends of the monomer that reactwith dianhydride to propagate a polymeric chain). Such additional aminemoieties could be used to crosslink the polymer or to provide otherfunctionality to the polymer.

Similarly, the term “dianhydride” as used herein is intended to mean thecomponent that reacts with (is complimentary to) the diamine and incombination is capable of reacting to form an intermediate (which canthen be cured into a polymer). Depending upon context, “anhydride” asused herein can mean not only an anhydride moiety per se, but also aprecursor to an anhydride moiety, such as: (i) a pair of carboxylic acidgroups (which can be converted to anhydride by a de-watering orsimilar-type reaction); or (ii) an acid halide (e.g., chloride) esterfunctionality (or any other functionality presently known or developedin the future which is) capable of conversion to anhydridefunctionality.

Depending upon context, “dianhydride” can mean: (i) the unreacted form(i.e. a dianhydride monomer, whether the anhydride functionality is in atrue anhydride form or a precursor anhydride form, as discussed in theprior above paragraph); (ii) a partially reacted form (i.e., the portionor portions of an oligomer or other partially reacted or precursorpolymer composition reacted from or otherwise attributable todianhydride monomer) or (iii) a fully reacted form (the portion orportions of the polymer derived from or otherwise attributable todianhydride monomer).

The dianhydride can be functionalized with one or more moieties,depending upon the particular embodiment selected in the practice of thepresent invention. Indeed, the term “dianhydride” is not intended to belimiting (or interpreted literally) as to the number of anhydridemoieties in the dianhydride component. For example, (i), (ii) and (iii)(in the paragraph above) include organic substances that may have two,one, or zero anhydride moieties, depending upon whether the anhydride isin a precursor state or a reacted state. Alternatively, the dianhydridecomponent may be functionalized with additional anhydride type moieties(in addition to the anhydride moieties that react with diamine toprovide a polymer). Such additional anhydride moieties could be used tocrosslink the polymer or to provide other functionality to the polymer.

In polyimide synthesis, each polymerized monomer (when polymerized intoa polyimide backbone between two other monomers) will generally formnitrogen-benzene imide linkages (on each side of the polymerizedmonomer). For the aromatic polyimides of the present invention thesenitrogen-benzene linkage pairs will be either: (i) collinearanti-parallel; (ii) crankshaft anti-parallel; or (iii)non-anti-parallel.

“Anti-parallel” is intended to mean parallel but oriented in oppositedirections. “Anti-parallel” is also intended to mean “substantially”anti-parallel whereby the imputed angle formed by the twonitrogen-benzene bonds (for the polyimide) or the two C—N bonds (ofamine end groups of the diamine monomer) is about 180°± up to 5, 10, 15,20, 25 or 30°.

Polyimide backbone configurations are difficult, if not impossible tofully verify, and therefore for purposes of this invention, thepolyimide backbone configuration is defined primarily (and preferably,solely) by the type of monomers used in creating the polyimide.

The polyimides of the present invention are synthesized by polymerizing:(i) aromatic crankshaft monomers, aromatic flexible monomers, or botharomatic crankshaft and aromatic flexible monomers; and (ii) one or moreother monomers selected from the group consisting of rigid rotationalmonomers, rigid non-rotational monomers, and rotational inhibitormonomers.

A “crankshaft monomer” is a monomer that has reactive ends that are alsoanti-parallel, but in contra-distinction to collinear monomers (wherethe ends are not offset), the reactive ends of the crankshaft monomerare also “offset”.

For purposes of the present invention, crankshaft monomers have or form“ends” that are offset and anti-parallel. When the monomer isincorporated into a polyimide polymer, these “ends” are typicallynitrogen-benzene linkages (or substituted derivations thereof) atadjacent imide (or imide-like) moieties along the polyimide polymer. Inmonomer form, the crankshaft monomer ends typically form a crankshaftconformation via the C—N bonds at the reactive ends of the monomer (thereactive ends that are used to propagate a polymeric chain). A thoroughdescription of crankshaft monomer embodiments is discussed in U.S. Pat.No. 6,956,098 B2.

Polyimides containing the crankshaft conformation provide ananti-parallel offset that is theoretically at least one-fourth,one-fifth, one-sixth, one-seventh or one-eighth of the average bondlength between the two crankshaft ends. While the offset distance canperhaps (at least theoretically) be calculated somewhat precisely for aparticularly crankshaft monomer, these distances are believed to change(or be significantly affected) after the monomer is polymerized into apolyamic acid or a polyimide, due to steric and other interactionsbetween the crankshaft along the polymer chain and the surroundingpolymeric matrix.

Hence, a precise offset distance for any particular crankshaft along anyparticular polymer chain within any particular polyimide or polymericmatrix, would be very difficult, perhaps impossible (and certainlyimpractical) to calculate or predict. Indeed, for purposes of thepresent invention, it is only critical that certain amounts of certaintypes of crankshaft monomers be used when polymerizing the polyimides.Whether or not crankshafts are actually formed along the resultingpolymer chains is not critical to the present invention.

Indeed, it may be (theoretically) possible that surrounding rod-likepolymer segments may force a crankshaft segment into more of a rod-likeconfiguration and these forces or interactions (rather than any actualcrankshaft configuration) may provide many, or all, of the advantages ofthe present invention. Hence, the crankshaft monomers of the presentinvention certainly provide unexpected advantages, especiallyout-of-plane crystal orientation and chain packing, but it is not acritical aspect of the present invention that these monomers form anyparticular backbone configuration-crankshaft, pseudo-crankshaft orotherwise.

While not intending to be bound by any particular theory, often thecrankshaft conformation of any given crankshaft monomer defines a lowerthermodynamic energy state than most, if not all, non-crankshaftconformations. Therefore, it seems possible, if not probable, that thecrankshaft monomers of the present invention preferentially formcrankshaft backbone segments along the polyimide polymer and that suchcrankshafts are perhaps compressed into a somewhat rod-likeconfiguration, due to the rigid, rod-like polymer segments connected toor surrounding the crankshaft segment.

However, polyimide backbone configurations are difficult, perhapsimpossible, to fully and precisely measure. So, it is not a requirementof the present invention that any particular polyimide backboneconfiguration, or conformation, be obtained or verified. Rather, thepresent invention recognizes that crankshaft monomers when polymerizedwith monomers selected from flexible, rigid rotational, rigidnon-rotational, and rotational inhibitor monomers (optionally also asmall mole percent of other monomers) can be combined in accordance withthe present invention to provide a polyimide polymer having unexpectedand advantageous properties, particularly for electronics typeapplications.

The crankshaft, flexible, rigid rotational, rigid non-rotational, androtational inhibitor monomers of the present invention each tend tocontribute to preferred polymer orientations, morphologies and packingefficiencies. While not intended to be held to (or limited by) anyparticular theory concerning the present invention, it is theorized thatduring polymerization, film formation, and/or imidization:

-   -   1. The crankshaft monomer (if it assumes a less preferred        non-crankshaft conformation) causes a change in direction of the        polymer chain, thereby allowing or creating polymer segments        with high rigidity to polymerize along different directions and        disrupting (at least to some extent) the otherwise highly        rod-like nature of the polymer matrix (this would then indicate        a lowering of the packing density and/or in-plane orientation,        of the polymeric material which in turn might explain the        increased out-of-plane orientation and efficient packing        believed to suppress dielectric loss as such;    -   2. The rigid rotational and rigid non-rotational collinear        monomers contribute to molecular rigidity and in-plane        orientation with a packing of the polymer chains within the same        plane, (the resulting densely packed, in-plane oriented polymer        segments are believed to provide improved strength properties,        e.g., modulus, to the polymer matrix);    -   3. The rotational inhibitor monomers contain pendant functional        groups that inhibit internal aromatic ring rotation via steric        hindrance and are believed to suppress dielectric loss as such;    -   4. Flexible monomers typically will contain aromatic ether        linkages with either p,p′-or m,m′-substitution patterns allowing        for additional polymer chain flexibility to enable preferential        orientations or formation of crystallites out of the plane of        the resulting film.

Ordinary skill and experimentation may be necessary in preparing thepolyimide films of the present invention, depending upon the particularmonomers selected and the particular polyimide film manufacturingprocess selected in the practice of the present invention.

In one embodiment, the films of the present invention further compriseone or more of the following properties:

-   -   1. A dielectric dissipation loss factor, or D_(f), (at 10 GHz)        of less than or equal to 0.005, 0.004, 0.0035, 0.003, 0.0025,        0.002 or 0.0015;    -   2. A water absorption of less than or equal to 2.0%, 1.5%,        1.35%, 1.25%, 1.2%, 1.0%;    -   3. A water vapor transport rate of less than or equal to 50, 40,        35, 30, 25, 20, 15 or 10 (g×mil)/(m²×day).

It would be impractical to discuss or describe all possible polyimidefilm manufacturing processes useful in the practice of the presentinvention. It should be appreciated that the monomer systems of thepresent invention are capable of providing the above-describedadvantageous film properties in a variety of manufacturing processes.The films of the present invention can be manufactured as describedherein and can be readily manufactured in any one of many (perhapscountless) ways of those film manufacturers ordinarily skilled in theart using any conventional polyimide film manufacturing technology.

Crankshaft Monomers

In one embodiment, for a crankshaft monomer, a crankshaft-type diamineand/or dianhydride monomer may be used. A crankshaft diamine monomer caninclude 3,4′-oxydianiline (3,4′-ODA) or a functional derivative thereof.3,4′-oxydianiline is also sometimes referred to as 3,4′-diaminodiphenylether (3,4′-DADE). Other examples of crankshaft monomers include anydiamine where an amine is attached to each of two separate benzene rings(whether the benzene ring is substituted, unsubstituted, functionalizedor unfunctionalized, and whether it is a single ring, fused with anotherring or otherwise), where the benzene rings are the same or differentand where the benzene rings are connected by a bridging group between atleast one or more other benzene rings. Useful bridging groups include—O—, —N(H)—C(O)—, —S—, —SO2—, —C(O)—, —C(O)O—, —C(CH3)2—, —C(CF3)2—,—C(R,R′)— where R and R′ are the same or different and are any organicgroup capable of bonding to a carbon, or the like. Depending upon thestructure, the amines may be ortho, meta or para to the bridging groupconnection. Due to steric hindrance, the meta and para positions aregenerally preferred.

A crankshaft dianhydride monomer can include3,3′4,4′-biphenyltetracarboxylic dianhydride (BPDA) or a functionalderivative thereof. Other examples include functional derivatives of3,3′,4,4′-biphenyltetracarboxylic dianhydride like a dicarboxylic acid,and lower alcohol esters of the acids. As with crankshaft diamines,other examples of crankshaft dianhydrides include dianhydrides having abridging group between two aromatic moieties. Useful such bridginggroups may include —O—, —N(H)—C(O)—, —S—, —SO2—, —C(O)—, —C(O)O—,—C(CH3)2—, —C(CF3)2—, —C(R,R′)— where R and R′ are the same or differentand are any organic group capable of bonding to a carbon, or the like.Depending upon the structure, the amines may be ortho, meta or para tothe bridging group connection. Due to steric hindrance, the meta andpara positions are generally preferred. Other examples of crankshaftdiamines are ester-containing diamines represented by the following:

Crankshaft dianhydrides are also possible using a naphthalene basedbackbone between the anhydride moieties.

Flexible Monomers

In one embodiment, flexible monomers contain a plurality of diphenylether and benzophenone linkages. Incorporating these groupssignificantly increase the coefficient of volume expansion of polyimides because of their rotational freedom and bending motions of the mainchains accompanied by large free volumes. The flexibility or rigidity ofa monomer can be quantified in terms of the Kier flexibility index (seeKier, L. B., Quant. Struct.-Act. Relat. 8, 221-224 (1989)). Thisdescriptor encodes information pertaining to the number of atoms,cyclicity, heteroatom content, branching and spatial density of themolecule. Larger flexibility indices indicate more rotational freedom.As used herein, the term “flexible monomer” is intended to mean monomerswith a Kier flexibility of from about 7.0 to about 14.0. Examples offlexible diamines include, but are not limited to, 4,4′-oxydianiline(ODA, 4,4′-ODA), 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP),1,3-bis(3-aminophenoxy)benzene (133APB, RODA) and1,3-bis(4-aminophenoxy)benzene (134APB, RODA). An example of a flexibledianhydride is 4,4′-oxydiphthalic anhydride (ODPA).

Rotational Inhibitor Monomers

In one embodiment, rotational inhibitor monomers are selected fromcompounds containing a restricted rotational isomer, namely2,2′-substituted benzidines. The steric hindrance of the 2,2′substituted benzidines contribute to a high rotational barrier to thepolyimide chains during the glass transition state. Since the pendantgroups exist at the 2,2′ prime positions, the most probableconformations for these diamines are around 90° and 270°. Namely, thetwo phenylene rings are almost perpendicular to each other in thepolyimides they comprise. Furthermore, the rotational angledistributions of the most probable conformations are very narrowindicative of very small degrees of rotational freedom along thebenzidine phenyl-phenyl bond linkage with any rotation accompanied by asignificant energetic penalty. Should the rotation proceed any further,the 2,2′ substituents quickly come into contact with the neighboringphenylene ring. Therefore, the angles of 90 and 270° are nearlylocked-in positions for the diamine. As a result, one can conclude it isnot possible for a phenylene with a substituent in the 2 or 2′ positionto independently rotate to a large extent around phenyl-phenyl bondlinkage. Examples of rotational inhibitor monomers are2,2′-dimethyl-4,4′-diaminodiphenyl (MTB) and2,2′-bis(trifluoromethyl)benzidine (TFMB). Although rotational inhibitormonomers have a Kier flexibility of from about 7.0 to about 10.0, forthe purposes of the present invention, these monomers are identified asrotational inhibitor monomers and not more broadly as flexible monomers.

Rigid Rotational and Non-Rotational Monomers

In one embodiment, a rigid rotational monomer is selected from“collinear” type monomers. A “Collinear monomer” is intended to mean apolyimide monomer (either dianhydride or diamine) having a dominantrod-like conformation, at least when polymerized into a substantiallyrod-like (e.g., linear and rigid) polymer chain segment or a matrix ofsubstantially rod-like polymer chain segments. Hence, the collinearmonomer will have reactive ends (used to link the monomer into apolymeric backbone structure upon polymerization) that are anti-paralleland substantially linear. Presumably, collinear monomers (whenpolymerized between two other monomers) form a pair of collinear,anti-parallel nitrogen-benzene imide linkages on each side of thepolymerized monomer. Typically, these monomers have para-para′substitution patterns. In addition, rigid rotational monomers have lowB-relaxation temperatures and smaller rotational barriers for pi fliposcillations, allowing for rotation of the aromatic ring. The secondary(subglass) main-chain β-relaxation process involves local motions of thepolymer chain backbone, such as phenyl ring flips, that do not requirecooperative motion of surrounding chains and that the main-chainβ-relaxation process is a precursor for the primary α-(glass) relaxationprocess. Examples of collinear monomers that are rigid rotationalmonomers are p-phenylenediamine (PPD) and5-amino-2-(p-aminophenyl)benzoxazole (P-DAMBO, PIBO).

In one embodiment, a rigid non-rotational monomer may be selected from“collinear” type monomers which may or may not be anti-parallel. Thesemonomers typically have higher relative β-relaxation temperatures andresultantly higher rotational barriers for pi flip oscillationseffectively freezing any local polyimide chain motion. Examples of rigidnon-rotational monomers are pyromellitic dianhydride (PMDA) and1,3-diaminobenzene (MPD).

In one embodiment, rigid non-rotational monomers can include1,5-diaminonaphthalene, dibromopyromellitic dianhydride,3,4,9,10-perylenetetracarboxylic dianhydride,naphthalene-1,4,5,8-tetracarboxylic dianhydride, 1,6-diaminopyrene and3,6-diaminocarbazole.

Rigid rotational and non-rotational monomers have a Kier flexibility ofless than about 6.0.

Regardless of the monomers used, aromatic polyimide chains consist ofelectron-dense and relatively electron-poor regions, which arise fromaromatic diamine and dianhydride moieties, respectively. It is believedthat electronic polarization can occur between these groups.Intermolecular charge polarization occurs when a group in one chaindonates some of its electron density to an electron-deficient group inanother chain. This phenomenon is called “charge transfer complexation”.

Due to the stiffness of linear rigid-rod and segmented rigid-rodpolyimides, chain-chain interactions can occur over several consecutiverepeat units. Consequently, the segments can become aligned along theiraxes. It is believed that this alignment contributes to the formation ofshort-range order and crystallinity. An accurate physical picture hasnot yet been developed for chain-chain interactions comprisingcharge-transfer and crystalline-type interactions. Polyimides containingamorphous and crystalline (or “ordered”) regions are known as two-phaseor semi-crystalline polymers. Two-phase linear thermoplastic polyimidesare known for high T_(g)'s, excellent solvent resistance and resistanceto thermal/mechanical distortion at temperatures just above T_(g). Dueto these outstanding properties, several commercially availablepolyimides in this category have found widespread use as interlayerdielectrics in electronic packaging.

Other Co-Monomers

In one embodiment, additional co-monomers can be used in synthesizingpolyimide polymers, provided that the additional co-monomers are lessthan 30, 25, 20, 15, 10, 5, 2, 1 or 0.5 mole percent of the finalpolyimide polymer. To the extent the below monomers do not otherwise fitwithin one of the definitions for the monomers outlined above, any ofthe following are examples that may be used as an additional co-monomerfor embodiments of the present invention:

-   -   2,3,6,7-naphthalene tetracarboxylic dianhydride;    -   1,2,5,6-naphthalene tetracarboxylic dianhydride;    -   benzidine;    -   substituted benzidine (e.g., 2,2′-bis(trifluoromethylbenzidine)    -   2,3,3′,4′-biphenyl tetracarboxylic dianhydride;    -   2,2′,3,3′-biphenyl tetracarboxylic dianhydride;    -   3,3′,4,4′-benzophenone tetracarboxylic dianhydride;    -   2,3,3′,4′-benzophenone tetracarboxylic dianhydride;    -   2,2′,3,3′-benzophenone tetracarboxylic dianhydride;    -   2,2-bis(3,4-dicarboxyphenyl) propane dianhydride;    -   bis(3,4-dicarboxyphenyl) sulfone dianhydride;    -   1,1-bis(2,3-dicarboxyphenyl) ethane dianhydride;    -   1,1-bis(3,4-dicarboxyphenyl) ethane dianhydride;    -   bis(2,3-dicarboxyphenyl) methane dianhydride;    -   bis(3,4-dicarboxyphenyl) methane dianhydride;    -   4,4′-(hexafluoroisopropylidene) diphthalic anhydride    -   oxydiphthalic dianhydride;    -   bis(3,4-dicarboxyphenyl) sulfone dianhydride;    -   bis(3,4-dicarboxyphenyl) sulfoxide dianhydride;    -   thiodiphthalic dianhydride;    -   2,2 bis-(4-aminophenyl) propane;    -   4,4′-diamino diphenyl methane;    -   4,4′-diamino diphenyl sulfide;    -   3,3′-diamino diphenyl sulfone;    -   4,4′-diamino diphenyl sulfone;    -   4,4′-diamino diphenyl ether;    -   1,5-diamino naphthalene;    -   4,4′-diamino-diphenyl diethylsilane;    -   4,4′-diamino diphenylsilane;    -   4,4′-diamino diphenyl ethyl phosphine oxide;    -   4,4′-diamino diphenyl N-methyl amine;    -   4,4′-diamino diphenyl-N-phenyl amine;    -   1,3-diaminobenzene;    -   1,2-diaminobenzene;    -   2,2-bis(4-aminophenyl) 1,1,1,3,3,3-hexafluoropropane;    -   2,2-bis(3-aminophenyl) 1,1,1,3,3,3-hexafluoropropane;    -   and the like.

Any one of a number of polyimide manufacturing processes may be used toprepare polyimide for polymer films. It would be impossible to discussor describe all possible manufacturing processes useful in the practiceof the present invention. It should be appreciated that the monomersystems of the present invention are capable of providing theabove-described advantageous properties in a variety of manufacturingprocesses. The compositions of the present invention can be manufacturedas described herein and can be readily manufactured in any one of many(perhaps countless) ways of those of ordinarily skilled in the art,using any conventional or non-conventional manufacturing technology.

Although methods and materials similar or equivalent to those describedherein can be used in the practice or testing of the present invention,suitable methods and materials are described herein.

When an amount, concentration, or other value or parameter is given aseither a range, preferred range or a list of upper preferable values andlower preferable values, this is to be understood as specificallydisclosing all ranges formed from any pair of any upper range limit orpreferred value and any lower range limit or preferred value, regardlessof whether ranges are separately disclosed. Where a range of numericalvalues is recited herein, unless otherwise stated, the range is intendedto include the endpoints thereof, and all integers and fractions withinthe range. It is not intended that the scope of the invention be limitedto the specific values recited when defining a range.

In describing certain polymers, it should be understood that sometimesapplicants are referring to the polymers by the monomers used to makethem or the amounts of the monomers used to make them. While such adescription may not include the specific nomenclature used to describethe final polymer or may not contain product-by-process terminology, anysuch reference to monomers and amounts should be interpreted to meanthat the polymer is made from those monomers or that amount of themonomers, and the corresponding polymers and compositions thereof.

The materials, methods, and examples herein are illustrative only and,except as specifically stated, are not intended to be limiting.

As used herein, the terms “comprises,” “comprising,” “includes,”“including,” “has,” “having” or any other variation thereof, areintended to cover a non-exclusive inclusion. For example, a method,process, article, or apparatus that comprises a list of elements is notnecessarily limited only those elements but may include other elementsnot expressly listed or inherent to such method, process, article, orapparatus. Further, unless expressly stated to the contrary, “or” refersto an inclusive or and not to an exclusive or. For example, a conditionA or B is satisfied by any one of the following: A is true (or present)and B is false (or not present), A is false (or not present) and B istrue (or present), and both A and B are true (or present).

Also, use of the “a” or “an” are employed to describe elements andcomponents of the invention. This is done merely for convenience and togive a general sense of the invention. This description should be readto include one or at least one and the singular also includes the pluralunless it is obvious that it is meant otherwise.

Organic Solvents

Useful organic solvents for the synthesis of the polymers of the presentinvention are preferably capable of dissolving the polymer precursormaterials. Such a solvent should also have a relatively low boilingpoint, such as below 225° C., so the polymer can be dried at moderate(i.e., more convenient and less costly) temperatures. A boiling point ofless than 210, 205, 200, 195, 190, or 180° C. is preferred.

Solvents of the present invention may be used alone or in combinationwith other solvents (i.e., cosolvents). Useful organic solvents include:N-methylpyrrolidone (NMP), dimethylacetamide (DMAc),N,N′-dimethyl-formamide (DMF), dimethyl sulfoxide (DMSO), tetramethylurea (TMU), diethyleneglycol diethyl ether, 1,2-dimethoxyethane(monoglyme), diethylene glycol dimethyl ether (diglyme),1,2-bis-(2-methoxyethoxy) ethane (triglyme), bis [2-(2-methoxyethoxy)ethyl)] ether (tetraglyme), gamma-butyrolactone, andbis-(2-methoxyethyl) ether, tetrahydrofuran. In one embodiment,preferred solvents include N-methylpyrrolidone (NMP) anddimethylacetamide (DMAc).

Co-solvents can generally be used at about 5 to 50 weight percent of thetotal solvent, and useful such co-solvents include xylene, toluene,benzene, “Cellosolve” (glycol ethyl ether), and “Cellosolve acetate”(hydroxyethyl acetate glycol monoacetate).

Polymer Films

In one embodiment, a polymer film having a polyimide can be produced bycombining a diamine and a dianhydride (monomer or other polyimideprecursor form) together with a solvent to form a polyamic acid (alsocalled a polyamide acid) solution. The dianhydride and diamine can becombined in a molar ratio of about 0.90 to 1.10. The molecular weight ofthe polyamic acid formed therefrom can be adjusted by adjusting themolar ratio of the dianhydride and diamine.

In one embodiment, a polyamic acid casting solution is derived from thepolyamic acid solution. The polyamic acid casting solution preferablycomprises the polyamic acid solution can optionally be combined withconversion chemicals like: (i) one or more dehydrating agents, such as,aliphatic acid anhydrides (acetic anhydride, etc.) and/or aromatic acidanhydrides; and (ii) one or more catalysts, such as, aliphatic tertiaryamines (triethyl amine, etc.), aromatic tertiary amines (dimethylaniline, etc.) and heterocyclic tertiary amines (pyridine, picoline,isoquinoline, etc.). The anhydride dehydrating material it is often usedin molar excess compared to the amount of amide acid groups in thepolyamic acid. The amount of acetic anhydride used is typically about2.0-4.0 moles per equivalent (repeat unit) of polyamic acid. Generally,a comparable amount of tertiary amine catalyst is used. Nanoparticles,dispersed or suspended in solvent as described above, are then added tothe polyamic acid solution.

In one embodiment, the polyamic acid solution, and/or the polyamic acidcasting solution, is dissolved in an organic solvent at a concentrationfrom about 5.0 or 10% to about 15, 20, 25, 30, 35 and 40% by weight.

The polyamic acid (and casting solution) can further comprise any one ofa number of additives, such as processing aids (e.g., oligomers),antioxidants, light stabilizers, flame retardant additives, anti-staticagents, heat stabilizers, ultraviolet absorbing agents, inorganicfillers or various reinforcing agents. Inorganic fillers can includethermally conductive fillers, metal oxides, inorganic nitrides and metalcarbides, and electrically conductive fillers like metals, graphiticcarbon and carbon fibers. Common inorganic fillers are alumina, silica,silicon carbide, diamond, clay, talc, boron nitride, aluminum nitride,titanium dioxide, dicalcium phosphate, and fumed metal oxides. Commonorganic fillers include polyaniline, polythiophene, polypyrrole,polyphenylenevinylene, polydialkylfluorenes, carbon black, graphite,multiwalled and single walled carbon nanotubes and carbon nanofibers. Inone embodiment, the polymer film can contain up to about 20 wt % of afiller and still maintain good low-loss properties.

The solvated mixture (the polyamic acid casting solution) can then becast or applied onto a support, such as an endless belt or rotatingdrum, to give a film. In one embodiment, the polyamic acid can besolution cast in the presence of an imidization catalyst. Use of animidization catalyst can help to lower the imidization temperature andshorten the imidization time, and can also help in the formation ofrefractive index-matching nanoparticle aggregates that essentiallymaintain the volume ratio of low and high index nanoparticles in theaggregate. Typical imidization catalysts can range from bases such asimidazole, 1-methylimidazole, 2-methylimidazole, 1,2-dimethylimidazole,2-phenylimidazole, benzimidazole, isoquinoline, or substituted pyridinessuch as methyl pyridines, lutidine, and trialkylamines. Combinations ofthe tertiary amines with acid anhydrides can be used. These dehydrationagents, which can act as co-catalysts, include acetic anhydride,propionic anhydride, n-butyric anhydride, benzoic anhydride and others.The ratio of these catalysts and their concentration in the polyamicacid layer will influence imidization kinetics and the film properties.Next, the solvent containing-film can be converted into aself-supporting film by heating at an appropriate temperature (thermalcuring) together with conversion chemical reactants (chemical curing).The film can then be separated from the support, oriented such as bytentering, with continued thermal and chemical curing to provide apolyimide film.

Useful methods for producing polymer films containing a polyimide inaccordance with the present invention can be found in U.S. Pat. Nos.5,166,308 and 5,298,331, which are incorporate by reference into thisspecification for all teachings therein. Numerous variations are alsopossible, such as,

-   -   (a) A method wherein the diamine components and dianhydride        components are preliminarily mixed together and then the mixture        is added in portions to a solvent while stirring.    -   (b) A method wherein a solvent is added to a stirring mixture of        diamine and dianhydride components. (contrary to (a) above)    -   (c) A method wherein diamines are exclusively dissolved in a        solvent and then dianhydrides are added thereto at such a ratio        as allowing to control the reaction rate.    -   (d) A method wherein the dianhydride components are exclusively        dissolved in a solvent and then amine components are added        thereto at such a ratio to allow control of the reaction rate.    -   (e) A method wherein the diamine components and the dianhydride        components are separately dissolved in solvents and then these        solutions are mixed in a reactor.    -   (f) A method wherein the polyamic acid with excessive amine        component and another polyamic acid with excessive dianhydride        component are preliminarily formed and then reacted with each        other in a reactor, particularly in such a way as to create a        non-random or block copolymer.    -   (g) A method wherein a specific portion of the amine components        and the dianhydride components are first reacted and then the        residual diamine components are reacted, or vice versa.    -   (h) A method wherein the conversion chemicals (catalysts) are        mixed with the polyamic acid to form a polyamic acid casting        solution and then cast to form a gel film.    -   (i) A method wherein the components are added in part or in        whole in any order to either part or whole of the solvent, also        where part or all of any component can be added as a solution in        part or all of the solvent.    -   (j) A method of first reacting one of the dianhydride components        with one of the diamine components giving a first polyamic acid.        Then reacting another dianhydride component with another amine        component to give a second polyamic acid. Then combining the        amic acids in any one of a number of ways prior to film        formation.

In one embodiment, if the polyimide is soluble in a non-protic solvent,such as DMAc or NMP, the polyimide can be formed in solution, optionallywith the addition of catalysts at higher temperatures (>50° C.). Afterfiltration, the polyimide powder can be re-dissolved in a solvent. Thepolyimide solution can then be cast onto a support (e.g. a moving beltor rigid support) and coalesced to create a polyimide film.

The thickness of the polymer film may be adjusted, depending on theintended purpose of the film or final application specifications. In oneembodiment, the polymer film has a total thickness in a range of fromabout 10 to about 150 μm, or from about 10 to about 80 μm, or from about10 to about 25 μm, or from about 15 to about 25 μm.

Metal-Clad Laminates

In one embodiment, a conductive layer of the present invention can becreated by:

-   -   i. metal sputtering (optionally, then electroplating);    -   ii. foil lamination; and/or    -   iii. any conventional or non-conventional method for applying a        thin metallic layer to a substrate.

Metal-clad laminates can be formed as single-sided laminates ordouble-sided laminates by any number of well-known processes. In oneembodiment, a lamination process may be used to form a metal-cladlaminate with a polymer film, such as a multilayer film. In oneembodiment, a first outer layer including a first thermoplasticpolyimide is placed between a first conductive layer and a core layer,and a second outer layer including a second thermoplastic polyimide isplaced on the opposite side of the core layer. In one embodiment, asecond conductive layer is placed in contact with the second outer layeron a side opposite the core layer. One advantage of this type ofconstruction is that the lamination temperature of the multilayer filmis lowered to the lamination temperature necessary for the thermoplasticpolyimide of the outer layer to bond to a conductive layer(s). In oneembodiment, the conductive layer(s) is a metal layer(s).

For example, prior to the step of applying a polymer film onto a metalfoil, the polymer film can be subjected to a pre-treatment step.Pre-treatment steps can include, heat treatment, corona treatment,plasma treatment under atmospheric pressure, plasma treatment underreduced pressure, treatment with coupling agents like silanes andtitanates, sandblasting, alkali-treatment, acid-treatments, and coatingpolyamic acids. To improve the adhesion strength, it is generally alsopossible to add various metal compounds as disclosed in U.S. Pat. Nos.4,742,099; 5,227,244; 5,218,034; and 5,543,222, incorporated herein byreference.

In addition, (for purposes of improving adhesion) the conductive metalsurface may be treated with various organic and inorganic treatments.These treatments include using silanes, imidazoles, triazoles, oxide andreduced oxide treatments, tin oxide treatment, and surfacecleaning/roughening (called micro-etching) via acid or alkalinereagents.

In a further embodiment, the polyamic acid precursor (to a polyimidefilm of the present invention) may be coated on a fully cured polyimidebase film or directly on a metal substrate and subsequently imidized byheat treatment. The polyimide base film may be prepared by either achemical or thermal conversion process and may be surface treated, e.g.by chemical etching, corona treatment, laser etching etc., to improveadhesion.

As used herein, the term “conductive layers” and “conductive foils” meanmetal layers or metal foils (thin compositions having at least 50% ofthe electrical conductivity of a high-grade copper). Conductive foilsare typically metal foils. Metal foils do not have to be used aselements in pure form; they may also be used as metal foil alloys, suchas copper alloys containing nickel, chromium, iron, and other metals.The conductive layers may also be alloys of metals and are typicallyapplied to the polyimides of the present invention via a sputtering stepfollowed by an electro-plating step. In these types of processes, ametal seed coat layer is first sputtered onto a polyimide film. Finally,a thicker coating of metal is applied to the seed coat viaelectro-plating or electro-deposition. Such sputtered metal layers mayalso be hot pressed above the glass transition temperature of thepolymer for enhanced peel strength.

Particularly suitable metallic substrates are foils of rolled, annealedcopper or rolled, annealed copper alloy. In many cases, it has proved tobe advantageous to pre-treat the metallic substrate before coating. Thispre-treatment may include, but is not limited to, electro-deposition orimmersion-deposition on the metal of a thin layer of copper, zinc,chrome, tin, nickel, cobalt, other metals, and alloys of these metals.The pre-treatment may consist of a chemical treatment or a mechanicalroughening treatment. It has been found that this pre-treatment enablesthe adhesion of the polyimide layer and, hence, the peel strength to befurther increased. Apart from roughening the surface, the chemicalpre-treatment may also lead to the formation of metal oxide groups,enabling the adhesion of the metal to a polyimide layer to be furtherincreased. This pre-treatment may be applied to both sides of the metal,enabling enhanced adhesion to substrates on both sides.

In one embodiment, a metal-clad laminate can include the polymer filmthat is a multilayer film and a first metal layer adhered to an outersurface of the first outer layer of the multilayer film. In oneembodiment, a metal-clad laminate can include a second metal layeradhered to an outer surface of the second outer layer of the multilayerfilm. In one embodiment, the first metal layer, the second metal layeror both metal layers can be copper. In one embodiment, a metal-cladlaminate of the present invention comprising a double side copper-cladcan be prepared by laminating copper foil to both sides of themultilayer film.

In another embodiment, the polymer films of the present invention areused as a material to construct a planar transformer component. Theseplanar transformer components are commonly used in power supply devices.

In yet another embodiment, the polymer films of the present inventionmay be used with thick metal foils to form flexible heaters. Theseheaters are typically used in automotive and aerospace applications.

The polymer films of the present invention exhibit excellentattenuation. The polyimides of the present invention can often exhibitan attenuation value, measured in decibels per inch, of about 0.3 at 10GHz using a 50 ohm micro strip.

In one embodiment, a polyimide precursor for a core layer and polyimideprecursors for first and second outer layers are cast simultaneously(using a multi-port die) to form a multilayer polyimide film (aftercuring of the polyamic acid layers). This multilayer film is then bondedto metal layer(s) using the thermoplastic polyimide of the outerlayer(s) as the bonding layer to the metal layer(s). Thus, a multilayerfilm metal-clad laminate formed comprises the multilayer film and atleast one conductive layer. Bonding of the multilayerpolyimide/metal-clad laminates, when a metal foil is used as theconductive layer, can take place in a double belt press in roll to rollprocessing, or in an autoclave in sheet to sheet processing.

Applications

In one embodiment, polymer films having polyimides with low dielectricdissipation loss factors can be used in a variety of electronic deviceswhere low-loss is required or advantageous. The emergence ofapplications using millimeter waves has been increasing and hasencouraged the development of new low-loss dielectric materials that canenhance signal integrity and increase area of coverage in several keymarket segments. In the consumer electronics segment, the nextgeneration of wireless networks, called “5G”, will benefit from low-lossflexible dielectrics in antenna feedline and digital input/outputcircuit fabrication. In the military and aerospace segment, high datathroughputs will be enhanced using low loss dielectrics for radar,antennas, unmanned air vehicle sensors, satellite communications, andreal-time video transmission.

In one embodiment, the polymer films of the present invention are usefulfor die pad bonding of flexible print connection boards or semiconductordevices or packaging materials for CSP (chip scale package), chip onflex (COF), COL (chip on lead), LOC (lead on chip), multi-chip module(“MCM”), ball grid array (“BGA” or micro-ball grid array), and/or tapeautomated bonding (“TAB”).

In another embodiment, the polymer films of the present invention may beused for wafer level integrated circuit packaging, where a composite ismade using a polymer film according to the present invention interposedbetween a conductive layer (typically a metal) having a thickness ofless than 100 μm, and a wafer comprising a plurality of integratedcircuit dies. In one (wafer level integrated circuit packaging)embodiment, the conductive passageway is connected to the dies by aconductive passageway, such as a wire bond, a conductive metal, a solderbump or the like.

The advantageous properties of this invention can be observed byreference to the following examples that illustrate, but do not limit,the invention. All parts and percentages are by weight unless otherwiseindicated.

EXAMPLES Test Methods Dielectric Constant and Dissipation Loss Factor

The relative complex permittivity (dielectric constant (D_(k)) anddissipation factor (D_(f))) of a material is measured in accordance withASTM method D2520-13. The samples were prepared using standardconditioning practices which include a pre-bake at 121° C. for 2 hralong with a conditioning step in which the sample is contained in anenvironmental chamber/conditioned lab. The temperature within thiscontainment is 23° C. (±1-5° C.) with a relative humidity (RH) of 50% RH(±5% RH) for 24 hrs.

Water Vapor Transmission Rate

The term “vapor transmission rate” is a measure of the rate at whichwater or another vapor is released (transmitted) through a film.Typically, water is absorbed into a polyimide film from the inherenthumidity in an ambient environment.

The water vapor transmission rate (WVTR) of a polyimide film is measuredin accordance with ASTM method F-1249. The units of measure on WVTR aregrams of water per day multiplied by the film thickness per square meterof film. This is a calculated number based upon film thickness and watervapor transmission rate. The films were run at 37.8° C. at 100% relativehumidity (RH).

Water Uptake

Thermogravimetric analysis (TGA) is the continuous measurement of weightloss of a specimen as the temperature is increased at a specific rate.Water uptake was measured using a TA-3000 thermal analyzer (MettlerToledo, Columbus, OH). Water absorption of polyimide films wasdetermined by placing strips of film in distilled water for 24 hours atroom temperature. The film samples were run and analyzed for watercontent by thermal gravimetric analysis at a rate of 10° C./minutebetween room temperature and 400° C. and analyzed from RT to 160° C. and160° C. to 400° C.

Thickness

Coating thickness was determined by measuring coated and uncoatedsamples in 5 positions across the profile of the film using acontact-type FISCHERSCOPE MMS PC2 modular measurement system thicknessgauge (Fisher Technology Inc., Windsor, CT).

Polymer Synthesis

All of the polymers for Examples 1 to 84 and Comparative Examples 1 to 7were synthesized in a similar manner, but using different combinationsof monomers. For example, a five-monomeric system, Example 60 (E60) wasmade as follows.

In a 300 ml jacketed beaker held at 45° C., purged in a nitrogen glovebox, 3.512 g (0.03248 mol) of p-phenylenediamine (PPD) was added to90.00 g of DMAc solvent (HPLC grade, Honeywell, USA). Once the PPD wasfully dissolved, 4.316 g (0.01476 mol) of 1,3-bis-(4-aminophenoxy)benzene (APB-134, RODA) and 2.508 g (0.01181 mol) of2,2′-dimethyl-4,4′-diaminobiphenyl (MTB) were added sequentially. Eachbottle was rinsed with an amount of DMAc. 15.376 g (0.052264 mol) of3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA) and 1.288 g(0.0059056 mol) of pyromellitic dianhydride (PMDA) were combined to makean admixture. Once mixed, the mixture was slowly added to the diaminesolution over a 45-minute time period while being continuously stirred.An amount of DMAc was used to rinse the dianhydride bottles and pouredinto the starting polyamic acid. The remainder of DMAc was added to makea total amount of DMAc to the mixture 123 g. The heating source wasremoved from the jacketed beaker (re-circulator was turned off) for theremainder of the synthesis. The polyamic acid mixed for several hoursand was then “finished” ˜500 poise (+/−50 poise) using small additionsof 6 wt % PMDA solution in DMAc. The polymer was de-gassed using acentrifugal-planetary mixer (THINKY USA, Laguna Hills, CA) to force thegas from the pre-polymer at 2000 rpm for 5 minutes followed by 2200 rpmfor 10 minutes. This procedure was repeated if further de-gassing of thepolymer was needed.

For a polymer film with filler, Example 84 (E84), the procedure of E60was followed, with the addition of the filler being made after all ofthe diamines were dissolved in DMAc. 7.2 g of talc (Fuji Talc IndustrialCo., Ltd., Japan) was added and allowed to mix for 60 minutes, followedby rinsing with DMAc and then the addition of the dianhydrides.

Films were made by casting the pre-polymer onto a glass surface using astainless-steel drawdown bar. The clearance was adjusted using Scotch™898 tape to adjust the clearance. The film was heated to a temperaturein the range of from about 85 to about 150° C. for 15 to 25 minutes andwas subsequently lifted off the glass surface and mounted onto an 8×10inch pin frame or a 12×12 inch pin frame. The mounted film was placed ina furnace and heated to a temperature in the range of from about 150 toabout 400° C. to fully imidize the film, and then removed and allowed tocool in air.

Examples 1 to 14 (E1-E14) demonstrate three-monomeric systems using themonomers as shown in Tables 1 to 3. More specifically, E1-E4 illustratesuitable concentrations of rigid non-rotational, crankshaft and flexiblemonomers. E5-E10 incorporate a different combination set usingcrankshaft or flexible, rigid rotational and rotational inhibitor.E11-E14 illustrate an appropriate combination using a differentcombination set, crankshaft, flexible and rigid rotational monomers.

TABLE 1 Dielectric WVTR Rigid Loss @ Water (g × mil)/ Non-RotationalCrankshaft Flexible 10 GHz Uptake % (m² × day) PMDA BPDA RODA BAPP E10.0022 0.785 10.0 10 40 50 E2 0.0025 0.775 12.4 25 25 50 E3 0.0031 0.6545.94 10 40 50 E4 0.0048 1.000 14.0 25 25 50

TABLE 2 Dielectric Water WVTR Rigid Rotational Loss @ Uptake (g × mil)/Crankshaft Flexible Rotational Inhibitor 10 GHz % (m² × day) BPDA ODPAPPD DAMBO MTB TFMB E5 0.0030 1.00 3.43 50 32.5 17.5 E6 0.0032 0.831 10.050 20 30 E7 0.0021 0.679 4.16 50 20 30 E8 0.0034 1.10 2.04 50 40 10 E90.0027 0.976 2.17 50 25 25 E10 0.0027 0.890 5.72 50 35 15

TABLE 3 Dielectric Water WVTR Rigid Loss @ Uptake (g × mil)/ CrankshaftFlexible Rotational 10 GHz % (m² × day) BPDA 3,4-ODA ODA PPD E11 0.00501.21 9.23 50 25 25 E12 0.0039 1.10 8.87 50 35 15 E13 0.0034 1.11 3.87 5025 25 E14 0.0025 0.880 2.92 50 35 15

Examples 15 to 52 demonstrate four-monomeric systems using the monomersas shown in Tables 4 to 7. More specifically, E15-E27 and E29-E43illustrate appropriate concentrations and combinations that incorporatemonomers from the crankshaft, flexible, rigid rotational and rotationalinhibitor categories. E28 and E45-E47 illustrate appropriateconcentrations and combinations that incorporate monomers from thecrankshaft, rigid non-rotational, rigid rotational and rotationalinhibitor categories. E44 and E48-E52 illustrate appropriateconcentrations and combinations that incorporate monomers from thecrankshaft, rigid non-rotational, rigid rotational and flexiblecategories.

TABLE 4 Dielectric Water WVTR Rigid Non- Rigid Rotational Loss @ Uptake(g × mil)/ Crankshaft Rotational Flexible Rotational Inhibitor 10 GHz %(m² × day) BPDA PMDA BPADA RODA BAPP PPD MTB E15 0.0024 0.732 3.02 5012.5 27.5 10 E16 0.0023 0.859 2.26 50 10 30 10 E17 0.0040 1.18 3.46 507.5 32.5 10 E18 0.0024 0.872 7.19 50 5 32.5 12.5 E19 0.0033 0.949 2.4150 5 37.5 7.5 E20 0.0036 1.10 2.57 50 5 40 5 E21 0.0040 0.982 2.70 50 542.5 2.5 E22 0.0046 1.16 7.49 50 5 37.5 7.5 E23 0.0050 1.17 11.5 50 5 405 E24 0.0083 1.42 9.20 50 5 42.5 2.5 E25 0.0042 1.19 14.0 50 7.5 32.5 10E26 0.0044 1.13 13.7 50 10 32.5 7.5 E27 0.0047 1.20 24.1 50 12.5 32.5 5E28 0.0031 0.946 2.14 45 5 32.5 17.5 E29 0.0044 1.45 19.2 45 5 40 10 E300.0036 1.05 18.7 35 15 40 10

TABLE 5 Dielectric Water WVTR Rigid Rotational Loss @ Uptake (g × mil)/Crankshaft Flexible Rotational Inhibitor 10 GHz % (m² × day) BPDA ODPAPPD MTB E31 0.0025 1.18 2.40 20 30 35 15 E32 0.0029 1.05 2.05 20 30 4010 E33 0.0030 1.01 1.59 20 30 45 5 E34 0.0041 1.27 1.92 25 25 35 15 E350.0036 1.11 7.75 30 20 35 15 E36 0.0028 0.972 1.92 30 20 20 30 E370.0035 0.998 1.40 30 20 30 20 E38 0.0023 0.882 1.84 30 20 40 10 E390.0029 1.01 1.56 30 20 45 5

TABLE 6 Dielectric Water WVTR Rigid Rotational Loss @ Uptake (g × mil)/Crankshaft Flexible Rotational Inhibitor 10 GHz % (m² × day) BPDA ODABAPP PPD MTB E40 0.0033 1.18 3.00 50 5 35 10 E41 0.0035 1.09 3.14 50 1035 5 E42 0.0039 1.16 2.23 50 5 37.5 7.5 E43 0.0041 0.823 7.87 50 7.532.5 10

TABLE 7 Dielectric Water WVTR Rigid Non- Rigid Rotational Loss @ Uptake(g × mil)/ Rotational Crankshaft Rotational Inhibitor Flexible 10 GHz %(m² × day) PMDA BPDA 3,4′-ODA PPD MTB RODA ODA E44 0.0046 1.19 0.987 644 47.5 2.5 E45 0.0042 1.17 2.99 6 44 47.5 2.5 E46 0.0037 1.30 2.43 6 4445 5 E47 0.0025 1.08 2.68 6 44 40 10 E48 0.0046 1.30 2.41 3.5 46.5 2.547.5 E49 0.0039 1.28 2.08 8.5 41.5 2.5 47.5 E50 0.0038 1.20 2.14 8.541.5 47.5 2.5 E51 0.0040 1.11 2.78 6 44 47.5 2.5 E52 0.0048 1.40 4.373.5 46.5 47.5 2.5

Examples 53 to 81 (E53-E81) demonstrate five-monomeric systems using themonomers as shown in Tables 8 to 10, incorporating monomers from allfive categories, rigid non-rotational, crankshaft, flexible, rigidrotational, and rotational inhibitor.

TABLE 8 Dielectric Water WVTR Rigid Rigid Rotational Loss @ Uptake (g ×mil)/ Non-Rotational Crankshaft Flexible Rotational Inhibitor 10 GHz %(m2 × day) PMDA MPD BPDA RODA PPD MTB TFMB E53 0.0030 0.982 2.42 8.541.5 5 32.5 12.5 E54 0.0021 0.633 2.77 5 45 15.5 24.5 10 E55 0.00210.694 3.71 2.5 47.5 12.5 27.5 10 E56 0.0029 0.630 9.62 5 45 12.5 27.5 10E57 0.0027 0.858 7.92 15 5 35 12.5 32.5 E58 0.0042 1.79 2.21 5 45 7.532.5 10 E59 0.0052 1.11 2.42 10 40 7.5 32.5 10 E60 0.0022 0.973 2.83 545 12.5 27.5 10 E61 0.0025 0.908 8.23 10 40 12.5 27.5 10 E62 0.00230.854 2.64 5 45 10 30 10 E63 0.0023 0.647 3.03 10 40 10 30 10

TABLE 9 Dielectric Water WVTR Rigid Non- Rigid Rotational Loss @ Uptake(g × mil)/ Rotational Crankshaft Flexible Rotational Inhibitor 10 GHz %(m2 × day) PMDA BPDA RODA BAPP PPD MTB E64 0.0037 1.16 6.24 5 45 5 32.512.5 E65 0.0036 1.10 10.7 5 45 10 27.5 12.5 E66 0.0041 1.19 12.4 10 40 532.5 12.5 E67 0.0068 1.58 10.4 10 40 10 27.5 12.5 E68 0.0029 0.840 2.665 45 5 32.5 12.5 E69 0.0022 0.746 2.43 5 45 10 27.5 12.5 E70 0.0032 1.423.18 10 40 5 32.5 12.5 E71 0.0025 0.945 1.92 10 40 10 27.5 12.5

TABLE 10 Dielectric Water WVTR Rigid Rotational Loss @ Uptake (g × mil)/Crankshaft Flexible Rotational Inhibitor 10 GHz % (m2 × day) BPDA ODPABTDA RODA BAPP PPD TFMB MTB E72 0.0041 1.11 4.75 40 10 5 35 10 E730.0038 1.17 4.46 40 10 7.5 35 7.5 E74 0.0043 1.13 4.35 40 10 10 35 5 E750.0037 1.21 4.18 40 10 5 30 15 E76 0.0044 1.34 7.46 40 10 15 30 5 E770.0036 1.11 7.75 30 20 7.5 32.5 10 E78 0.0038 0.892 9.40 30 20 10 32.510 E79 0.0036 0.970 11.5 30 20 12.5 27.5 10 E80 0.0025 0.938 4.07 30 2035 5 10 E81 0.0025 1.01 4.60 30 20 32.5 7.5 10

Comparative Examples 1 to 9 (CE1-CE9) are shown in Tables 11, 12 and 13.More specifically, CE1-CE4 demonstrate that improper selection ofmonomers in a three-monomeric system results in polymer films for whichthe dielectric loss is not sufficiently low. Similarly, CE5-CE8represent undesirable concentrations of monomers from the rigidnon-rotational and flexible categories in four-monomeric systems, andCE9 represents an undesirable concentration of monomers for afive-monomer system.

TABLE 11 Dielectric Water Rigid Non- Loss @ Uptake Rotational CrankshaftFlexible 10 GHz % PMDA BPDA RODA ODA CE1 0.0089 0.977 35 15 50 CE20.0133 1.70 25 25 50 CE3 0.0078 1.37 35 15 50 CE4 0.0216 3.09 50 35 15

TABLE 12 Di- electric Rigid Loss Water Non- @ Uptake Rotational Flexible10 GHz % PMDA MPD RODA BAPP ODPA ODA CE5 0.0100 0.977 10 25 40 25 CE60.0750 1.70 10 40 40 10 CE7 0.0101 — 25 25 25 25 CE8 0.0092 — 15 25 2535

TABLE 13 Dielectric Water Rigid Non- Rigid Rotational Loss @ UptakeRotational Crankshaft Flexible Rotational Inhibitor 10 GHz % PMDA BPDARODA PPD MTB CE9 0.0082 1.89 25 25 5 32.5 12.5

Examples 82 to 84 (E82-E84), as shown in Table 14, demonstrate that thedesired low-loss properties can be maintained, even when adding a largeamount of filler, 20 wt % talc filler, to the polymer film. Although theD_(f) is slightly higher than for the unfilled films, it is still quitelow. E82 and E83 are filled versions of the four-monomeric systems ofE19 and E16, respectively, and E84 is a filled version of thefive-monomeric system of E60.

TABLE 14 System Type Dielectric Water # of Loss @ Uptake monomers 10 GHz% E82 4 0.0040 0.8 E83 4 0.0025 0.75 E84 5 0.0030 0.5

Note that not all of the activities described above in the generaldescription are required, that a portion of a specific activity may notbe required, and that further activities may be performed in addition tothose described. Still further, the order in which each of theactivities are listed are not necessarily the order in which they areperformed. After reading this specification, skilled artisans will becapable of determining what activities can be used for their specificneeds or desires.

In the foregoing specification, the invention has been described withreference to specific embodiments. However, one of ordinary skill in theart appreciates that various modifications and changes can be madewithout departing from the scope of the invention as set forth in theclaims below. All features disclosed in this specification may bereplaced by alternative features serving the same, equivalent or similarpurpose. Accordingly, the specification and figures are to be regardedin an illustrative rather than a restrictive sense and all suchmodifications are intended to be included within the scope of theinvention.

Benefits, other advantages, and solutions to problems have beendescribed above with regard to specific embodiments. However, thebenefits, advantages, solutions to problems, and any element(s) that maycause any benefit, advantage, or solution to occur or become morepronounced are not to be construed as a critical, required, or essentialfeature or element of any or all the claims.

What is claimed is:
 1. A polymer film comprising a polyimide, whereinthe polyimide comprises: two or more dianhydrides comprising: 15 to 35mol % of a first monomer that is a crankshaft monomer; and 15 to 35 mol% of a second monomer that is a flexible monomer; and two or morediamines comprising: 1 to 35 mol % of a third monomer that is arotational inhibitor monomer; and 15 to 49 mol % a fourth monomer thatis a rigid rotational monomer, wherein the mol % of each monomer isbased on the total of all four monomers, wherein the polymer film has: adielectric dissipation loss factor, D_(f), of 0.005 or less; a waterabsorption of 2.0% or less; and a water vapor transport rate of 50(g×mil)/(m² ×day) or less.
 2. The polymer film of claim 1, wherein thecrankshaft dianhydride monomer is 3,3′,4,4′-biphenyl tetracarboxylicdianhydride or a functional derivative thereof.
 3. The polymer film ofclaim 1, wherein the flexible dianhydride monomer is 4,4′-oxydiphthalicanhydride.
 4. The polymer film of claim 1, wherein the rotationalinhibitor diamine monomer is selected from the group consisting of of2,2′-dimethyl-4,4′-diaminodiphenyl, 2,2′-bis(trifluoromethyl)benzidineand mixtures thereof.
 5. The polymer film of claim 1, wherein the rigidrotational diamine monomer is selected from the group consisting ofp-phenylenediamine, 5-amino-2-(p-aminophenyl)benzoxazole and mixturesthereof.
 6. The polymer film of claim 1, further comprising a flexiblediamine monomer.
 7. The polymer film of claim 6, wherein the flexiblediamine monomer is selected from the group consisting of4,4′-oxydianiline, 2,2-bis[4-(4-aminophenoxy)phenyl]propane,1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene andmixtures thereof.
 8. The polymer film of claim 6, wherein the flexiblediamine monomer has a Kier flexibility in the range of from 7.0 to 14.0.9. The polymer film of claim 1, wherein the polymer film furthercomprises up to 20 wt % of a filler comprising an inorganic filler, anorganic filler or a mixture thereof.
 10. The polymer film of claim 9,wherein the filler comprises a thermally conductive filler.
 11. Thepolymer film of claim 1, wherein the polymer film has a dielectricdissipation loss factor, D_(f), of 0.0035 or less.
 12. The polymer filmof claim 1, wherein the polymer film has a water absorption of 1.25% orless.
 13. The polymer film of claim 1, wherein the polymer film has awater vapor transport rate of 15 (g×mil)/(m²×day) or less.
 14. Thepolymer film of claim 1, wherein the polymer film has a thickness in therange of from 10 to 150 μm.
 15. A metal-clad laminate comprising thepolymer film of claim 1 and a first metal layer adhered to a first outersurface of the polymer film.
 16. The metal-clad laminate of claim 15,further comprising a second metal layer adhered to a second outersurface of the polymer film.
 17. An electronic device comprising thepolymer film of claim 1.